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Die attach adhesion

发布时间:2019-05-15

Die attach adhesion
Die attach adhesion






Model 
Application
Features
Appearance
Viscosity 
(mPa·s)@25℃
Recommend cured condtion 
Shelf life
SE8205
Die attach adhesion
Lower shrinkage rate
Lower thermal expansion
Good adhesion to silicon materials
Red liquid
15000
20min@75℃;
15min@80℃;
6months
@-20℃


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